Jump to content

Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
No edit summary
Choi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, danchip
641 edits
Line 26: Line 26:
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|BHF:Etch of titanium with or without photoresist mask.
|BHF Etch of titanium with or without photoresist mask.
|Cold RCA1: Etch of titanium (as stripper or with eagle resist).  
|Cold RCA1 mix etch of titanium (as stripper or with eagle resist).  
|Dry plasma etch of Ti
|Dry plasma etch of Ti
|Sputtering of Ti - pure physical etch
|Sputtering of Ti - pure physical etch
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Etching_of_Titanium"