Specific Process Knowledge/Lithography/4562: Difference between revisions
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Using HMDS priming with AZ 4562 seems to cause more problems than it solves, and i generally not recommended. HMDS priming seems to make the adhesion worse, maybe due to accumulation of N2 at the resist-substrate interface. | Using HMDS priming with AZ 4562 seems to cause more problems than it solves, and i generally not recommended. HMDS priming seems to make the adhesion worse, maybe due to accumulation of N2 at the resist-substrate interface. | ||
If adhesion failure is an issue, a dehydration bake (e.g. 1min at 100°C) just before spin coating is recommended. | If adhesion failure is an issue, a dehydration bake (e.g. 1min at 100°C) just before spin coating is recommended. Storing the coated substrates before exposure also leads to adhesion failure after as little as a couple of days. | ||
==Spin coating== | ==Spin coating== | ||