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Specific Process Knowledge/Thermal Process/Storage and cleaning of wafer to the A, B, C and E stack furnaces: Difference between revisions

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==RCA cleaning of wafers for the A, B, C and E stack furnaces==


====A1 furnaces====
 
====A1 furnace====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
*Before boron pre-deposition, the silicon carbide boat and boron source wafers have to be RCA cleaned.
*Before boron pre-deposition, the silicon carbide boat and boron source wafers have to be RCA cleaned.


====A2 and A4 furnaces====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).


====A2 A3 and A4 furnaces====
====A3 furnaces====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
*Wafers from the A4 furnace can go directly into the furnace


====A4 furnace====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).


====B2, B3, B4, E2 and E3 furnaces (LPCVD furnaces)====
====B2, B3, B4, E2 and E3 furnaces (LPCVD furnaces)====
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*Wafers from the A stack furnaces and the C1 furnace can go directly into the furnace.  
*Wafers from the A stack furnaces and the C1 furnace can go directly into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  


====C1 furnace====
====C1 furnace====
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*Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.  
*Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  
====C2 furnace====
*Dedicated for oxidation of III-V materials. More information can be found here:




====C3 furnace====
====C3 furnace====
*New silicon wafers can go directly into the furnaces.  
*New silicon wafers can go directly into the furnaces.  
*Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.  
*Wafers from the A, B and E stack furnaces, from the C1 furnace and from Wafer Bonder 02 can go directly into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  
*Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.  
*Wafer pieces are allowed in the furnace, if these have been RCA cleaned.
*Wafer pieces are allowed in the furnace, if these have been RCA cleaned.


====C4 furnace====
*




==Storage and transportation of wafers for the A, B, C and E stack furnaces==


====RCA cleaned wafers====
*The wafers have to be stored in a dedicated blue or black "RCA transfer" box, until thy go into the furnace


====New wafers====
*The wafers have to be stored in clean boxes, i.e. boxes have only contained new wafers (do NOT use boxes from the dressing are), or they can be stored in dedicated blue or black "wafer transfer" boxes.


 
====Wafers from one furnace to another====
All wafers have to be RCA cleaned.  
*The wafers have to be stored in dedicated blue or black "wafer transfer" boxes.
 
[[/Oxidation|Oxidation]] - ''Grow a thermal oxide on silicon''
*[[/Annealing|Annealing]]
*[[/Dope with Boron|Doping with Boron]]
*[[/Dope with Phosphorus|Doping with Phosphorus]]

Revision as of 15:09, 3 December 2019

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RCA cleaning of wafers for the A, B, C and E stack furnaces

A1 furnace

  • All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
  • Before boron pre-deposition, the silicon carbide boat and boron source wafers have to be RCA cleaned.

A2 and A4 furnaces

  • All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).

A3 furnaces

  • All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).
  • Wafers from the A4 furnace can go directly into the furnace

A4 furnace

  • All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafers and dummy wafers (if needed).

B2, B3, B4, E2 and E3 furnaces (LPCVD furnaces)

  • New silicon wafers can go directly into the furnaces.
  • Wafers from the A stack furnaces and the C1 furnace can go directly into the furnace.
  • Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.

C1 furnace

  • New silicon wafers can go directly into the furnaces.
  • Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace.
  • Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.

C2 furnace

  • Dedicated for oxidation of III-V materials. More information can be found here:


C3 furnace

  • New silicon wafers can go directly into the furnaces.
  • Wafers from the A, B and E stack furnaces, from the C1 furnace and from Wafer Bonder 02 can go directly into the furnace.
  • Other processed wafers and quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.
  • Wafer pieces are allowed in the furnace, if these have been RCA cleaned.

C4 furnace


Storage and transportation of wafers for the A, B, C and E stack furnaces

RCA cleaned wafers

  • The wafers have to be stored in a dedicated blue or black "RCA transfer" box, until thy go into the furnace

New wafers

  • The wafers have to be stored in clean boxes, i.e. boxes have only contained new wafers (do NOT use boxes from the dressing are), or they can be stored in dedicated blue or black "wafer transfer" boxes.

Wafers from one furnace to another

  • The wafers have to be stored in dedicated blue or black "wafer transfer" boxes.
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