Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,416 edits
No edit summary
Line 23: Line 23:
| Pegasus/jmli
| Pegasus/jmli
| 10 minute TDESC clean
| 10 minute TDESC clean
| danchip/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins
| nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins
| S004693
| S004693
! New showerhead  
! New showerhead  

Revision as of 21:27, 25 November 2019

Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
2/12-2014 4" Wafer with travka50 mask AZ standard Si / 50 % Pegasus/jmli 10 minute TDESC clean nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins S004693 New showerhead

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