Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1: Difference between revisions
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'''Feedback to this page: | '''Feedback to this page: | ||
[mailto:labadviser@ | [mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]''' | ||
[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
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= DRIE-Pegasus 1= | = DRIE-Pegasus 1= | ||
[[Image:DRIE-Pegasus.jpg |frame|left|x300px|The DRIE-Pegasus 1 load lock and cassette loader in the | [[Image:DRIE-Pegasus.jpg |frame|left|x300px|The DRIE-Pegasus 1 load lock and cassette loader in the Nanolab cleanroom A-1]] | ||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | ||
Equipment info in [http://labmanager | Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=265| LabManager] | ||
== Process information == | == Process information == | ||
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]] | ||
More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto: | More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information. | ||
<!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] --> | <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] --> | ||
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'''Internal | '''Internal Nanolab Process log for Pegasus 1''' | ||
Process log at Danchip [http://labintra. | Process log at Danchip [http://labintra.nanolab.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus] | ||
Revision as of 21:00, 25 November 2019
Feedback to this page: click here
DRIE-Pegasus 1
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Equipment info in LabManager
Process information
Hardware changes
A few hardware modifications have been made on the Pegasus since it was installed in 2010. The changes are listed below.
Other etch processes
More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information.
Advanced Processing - Henri Jansen style
- Etch silicon nanostructures
- Etch high aspect ratio silicon microstructures
- Etch 3 dimensional silicon microstructures
- Etch black silicon
- Using OES to monitor etch process
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.
Acceptance test
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found here.
Characterisation of etched trenches
Comparing differences in etched trenches requires a set of common parameters for each trench. Click HERE to find more information about the parameters used on the DRIE-Pegasus process development.
Internal Nanolab Process log for Pegasus 1
Process log at Danchip [1]