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== Aluminum coating ==
== Aluminum coating ==


At DTU Danchip, we recommend to use a thin (20 nm) layer of thermally evaporated [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|aluminum]] on top of the e-beam resist. Preferably, the thickness of Al and the e-beam dose should be optimised to the features you wish to e-beam pattern [http://nedds.co.uk/wp-content/uploads/2013/06/Greer-et-al-DRM-29-July-2012.pdf]. A good starting point is 20 nm Al; from here dose and development can be optimised to reach the resolution and feature size required.
At DTU Nanolab, we recommend to use a thin (20 nm) layer of thermally evaporated [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|aluminum]] on top of the e-beam resist. Preferably, the thickness of Al and the e-beam dose should be optimised to the features you wish to e-beam pattern [http://nedds.co.uk/wp-content/uploads/2013/06/Greer-et-al-DRM-29-July-2012.pdf]. A good starting point is 20 nm Al; from here dose and development can be optimised to reach the resolution and feature size required.


The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]].
The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]].
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