Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D). | *Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D). | ||
|style="background:WhiteSmoke; color:black"| Only chips, max dimension about 20 x 20 mm. | |style="background:WhiteSmoke; color:black"| Only chips, max dimension about 20 x 20 mm. | ||
(If at least one dimension is less than 23 mm, bigger chips (e.g. 40 x 20) may be allowed - contact | (If at least one dimension is less than 23 mm, bigger chips (e.g. 40 x 20) may be allowed - contact Nanolab) | ||
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