Jump to content

Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

Jmli (talk | contribs)
No edit summary
Jmli (talk | contribs)
No edit summary
Line 2: Line 2:
<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->
<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->


[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]]
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
== Die bonder (eutectic metal soldering) ==
== Die bonder (eutectic metal soldering) ==