Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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'''Feedback to this page''': '''[mailto:photolith@ | '''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment click here]''' | ||
=Pretreatment= | =Pretreatment= | ||
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=HMDS= | =HMDS= | ||
'''Feedback to this section''': '''[mailto:photolith@ | '''Feedback to this section''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment#HMDS click here]''' | ||
The chemical treatment with hexamethyldisilazane (HMDS) before the spin coating can be used to promote the adhesion for photoresist. Vapor priming with HMDS leaves a mono-layer of TMS (trimethylsilyl) on the Si or SiO<sub>2</sub> surface. The process dehydrates the substrate surface, and lowers the surface tension. | The chemical treatment with hexamethyldisilazane (HMDS) before the spin coating can be used to promote the adhesion for photoresist. Vapor priming with HMDS leaves a mono-layer of TMS (trimethylsilyl) on the Si or SiO<sub>2</sub> surface. The process dehydrates the substrate surface, and lowers the surface tension. | ||
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'''The user manual, user APV, and contact information can be found in LabManager:''' | '''The user manual, user APV, and contact information can be found in LabManager:''' | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=54 HMDS oven in LabManager] | ||
===Process information=== | ===Process information=== | ||
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'''Additional information about the spin track and processes can be found in Labadviser:''' | '''Additional information about the spin track and processes can be found in Labadviser:''' | ||
[http://labadviser | [http://labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 Spin track 1 + 2 labadviser page] | ||
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'''Additional information about the spin coater and processes can be found in Labadviser:''' | '''Additional information about the spin coater and processes can be found in Labadviser:''' | ||
[http://labadviser | [http://labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#gamma_uv Spincoater: Gamma UV labadviser page] | ||
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=Buffered HF-Clean= | =Buffered HF-Clean= | ||
'''Feedback to this section''': '''[mailto:labadviser@ | '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment#Buffered_HF-Clean click here]''' | ||
[[Image:BHF_RR3.jpg|300x300px|thumb|Buffered HF-Clean in C-1]] | [[Image:BHF_RR3.jpg|300x300px|thumb|Buffered HF-Clean in C-1]] | ||
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'''The user manual, user APV, and contact information can be found in LabManager:''' | '''The user manual, user APV, and contact information can be found in LabManager:''' | ||
[http://labmanager. | [http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=64 Buffered HF-Clean in LabManager] | ||
===Process information=== | ===Process information=== | ||
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=Oven 250C= | =Oven 250C= | ||
'''Feedback to this section''': '''[mailto:labadviser@ | '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C click here]''' | ||
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment in C-1]] | [[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment in C-1]] | ||
The oven is typically used for pretreatment (dehydration) of Si and glass substrates to promote the resist adhesion. We recommend to place the wafers in metal carrier in the oven at least for 4 hours, better during the night, and spin the resist on them asap. | The oven is typically used for pretreatment (dehydration) of Si and glass substrates to promote the resist adhesion. We recommend to place the wafers in metal carrier in the oven at least for 4 hours, better during the night, and spin the resist on them asap. | ||
'''The user manual, and contact information can be found in LabManager: [http://labmanager | '''The user manual, and contact information can be found in LabManager: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=117 Oven 250C]''' | ||
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