Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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'''Feedback to this page''': '''[mailto: | '''Feedback to this page''': '''[mailto:fabricationSupport@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Electroplating-Ni click here]''' | ||
[[Category: Equipment|Thin film Electroplating Ni]] | [[Category: Equipment|Thin film Electroplating Ni]] | ||
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The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine. | The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine. | ||
The maximum allowed thickness is ~1,4 mm (1400 µm), since a higher thickness will make the release of the sample difficult and likely damage the sample holder. This corresponds to a charge of 53-54 Ah on a four inch wafer. Please contact | The maximum allowed thickness is ~1,4 mm (1400 µm), since a higher thickness will make the release of the sample difficult and likely damage the sample holder. This corresponds to a charge of 53-54 Ah on a four inch wafer. Please contact Nanolab before processing your wafer if you intend to deposit more than ~500 µm of nickel, since this can involve special challenges regarding uniformity, roughness and sample release after plating. | ||
The plating bath is an aqueous solution of nickel sulfamate, boric acid and sulfamic acid. The bath is moderately acidic (pH = 3,70). The pH is kept constant by an automatic pH measurement and sulfamic acid dosing module. The temperature of the bath is 52°C. The sample will spin at 60 RPM during deposition. | The plating bath is an aqueous solution of nickel sulfamate, boric acid and sulfamic acid. The bath is moderately acidic (pH = 3,70). The pH is kept constant by an automatic pH measurement and sulfamic acid dosing module. The temperature of the bath is 52°C. The sample will spin at 60 RPM during deposition. | ||
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager] | ||
== Process information == | == Process information == | ||