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Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA click here]'''
'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA click here]'''


==RCA cleaning==
==RCA cleaning==
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*Optional: HF: 30 sec (avoid it if you have a very thin oxide (0-200 Å) as the top layer)
*Optional: HF: 30 sec (avoid it if you have a very thin oxide (0-200 Å) as the top layer)
*DI water rinsing (bubbler)<br>
*DI water rinsing (bubbler)<br>
For procedure details please look in the [http://labmanager.danchip.dtu.dk/d4Show.php?id=1633&mach=243 user manual] in LabManager.
For procedure details please look in the [http://labmanager.dtu.dk/d4Show.php?id=1633&mach=243 user manual] in LabManager.


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<br \>
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'''The user manual, user APV and contact information can be found in LabManager:'''
'''The user manual, user APV and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=243 RCA info page in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=243 RCA info page in LabManager]


==Overview of RCA process data==
==Overview of RCA process data==
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4"-6" wafers <br />
4"-6" wafers <br />
For 2" wafers please contact Danchip staff
For 2" wafers please contact Nanolab staff
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4"-6" wafers <br />
4"-6" wafers <br />
For 2" wafers please contact Danchip staff
For 2" wafers please contact Nanolab staff
|
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4"-6" wafers <br />
4"-6" wafers <br />
For 2" wafers please contact Danchip staff
For 2" wafers please contact Nanolab staff
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