Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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<center><span style="background:#87CEEB">4th Level - Comparison</span></center> | <center><span style="background:#87CEEB">4th Level - Comparison</span></center> | ||
'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]''' | ||
Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe adhesion layers for gold deposition and the roughness of gold deposited in the Wordentec. | Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe adhesion layers for gold deposition and the roughness of gold deposited in the Wordentec. | ||