Specific Process Knowledge/Back-end processing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]''' | ||
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | ||
These processes are usually carried out a number of different places | These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346. | ||
Below you can see a list of equipment for back-end processing that is available at DTU | Below you can see a list of equipment for back-end processing that is available at DTU Nanolab. | ||
== Choose an equipment == | == Choose an equipment == | ||
Revision as of 13:23, 25 November 2019
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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
Choose an equipment
- Substrate/chip/die cleaning
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Molding
- X-ray inspection system
Choose processing method
| Lapping/polishing | Cutting | Milling | Die bonding | Wire bonding |