Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Hummer|Hummer]] - ''Gold sputtering system'' | *[[/Hummer|Hummer]] - ''Gold sputtering system'' | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||
*[[/Furnace LPCVD Nitride | *[[/B2 Furnace LPCVD Nitride|Furnace LPCVD Nitride (6")]] - ''Deposition of silicon nitride'' | ||
*[[/B2 Furnace LPCVD Nitride|B2 Furnace LPCVD Nitride]] - ''Deposition of silicon nitride'' | *[[/B2 Furnace LPCVD Nitride|B2 Furnace LPCVD Nitride]] - ''Deposition of silicon nitride'' | ||
*[[/B3 Furnace LPCVD TEOS|B3 Furnace LPCVD TEOS]] - ''Deposition of silicon oxide'' | *[[/B3 Furnace LPCVD TEOS|B3 Furnace LPCVD TEOS]] - ''Deposition of silicon oxide'' | ||
*[[/B4 Furnace LPCVD PolySilicon|B4 Furnace LPCVD PolySilicon]] - ''Deposition of polysilicon'' | *[[/B4 Furnace LPCVD PolySilicon|B4 Furnace LPCVD PolySilicon]] - ''Deposition of polysilicon'' | ||
*[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | *[[/MVD|MVD]] - ''Molecular Vapor Deposition'' | ||