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Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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* Hardware availability
* Hardware availability
* Processes required by users
* Processes required by users
The dry etch tools at Danchip all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will requrie the use of a carrier wafer. Using a carrier is also often required if the side of the wafer facing the electrode has structures.
The dry etch tools at Nanolab all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will requrie the use of a carrier wafer. Using a carrier is also often required if the side of the wafer facing the electrode has structures.


{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Processesing different sizes of wafers or chips in the dry etch tools at Danchip '''
|+ '''Processesing different sizes of wafers or chips in the dry etch tools at Nanolab '''
|-
|-
! Tool
! Tool
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