Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions
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| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" colspan=" | | style="background:WhiteSmoke; color:black" colspan="4" | Inductively coupled plasma chamber with two RF generators; the coil (with outer and inner coil) and platen generator | ||
| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes | | style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes | ||
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| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 20<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 20<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 60<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 60<sup>o</sup>C | ||
| style="background:lightgrey; color:black" colspan=" | | style="background:lightgrey; color:black" colspan="4" | The electrode is oil cooled. Also, Helium backside cooling: -20<sup>o</sup>C to 30<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C | ||
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| style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode)<br> Wafer size 4" | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 4" | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" colspan=" | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 4" | ||
| style="background:WhiteSmoke; color:black" colspan="3" | Electrostatic clamping (TDESC)<br> Wafer size 6" | |||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 6" | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 6" | ||
| style="background:WhiteSmoke; color:black" | No clamping<br> Sample size up to 4" | | style="background:WhiteSmoke; color:black" | No clamping<br> Sample size up to 4" | ||