Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions
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! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2|Pegasus 4]] | ! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2|Pegasus 4]] | ||
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! rowspan="2" style="background:silver; color:black | ! rowspan="2" style="background:silver; color:black" |Purpose | ||
! style="background:WhiteSmoke; color:black" | Primary uses | ! style="background:WhiteSmoke; color:black" | Primary uses | ||
| style="background:WhiteSmoke; color:black"| Formerly the primary silicon etcher; now polymers, Silicon oxides and nitrides may also be etched. 5% metal on the surface is allowed. | | style="background:WhiteSmoke; color:black"| Formerly the primary silicon etcher; now polymers, Silicon oxides and nitrides may also be etched. 5% metal on the surface is allowed. | ||