Specific Process Knowledge/Lithography/Descum: Difference between revisions
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==Plasma asher 2 == | |||
Descum of AZ Mir 701 resist on 100mm silicon wafer. Five wafers were placed vertically in chamber. | Descum of AZ Mir 701 resist on 100mm silicon wafer. Five wafers were placed vertically in chamber. | ||
Experiment parameters | <div style='text-align: left;'>Experiment parameters</div> | ||
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Revision as of 16:11, 19 November 2019
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Descum results
Plasma asher 1
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer.
Note: Plasma asher was cold before use
Plasma asher 2Descum of AZ Mir 701 resist on 100mm silicon wafer. Five wafers were placed vertically in chamber. Experiment parameters
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