|
|
Line 33: |
Line 33: |
| Conny Hjort & Jesper Hanberg | | Conny Hjort & Jesper Hanberg |
| September 2019 | | September 2019 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
| ===Plasma asher 2 ===
| |
|
| |
| [[Image:descum_graf.jpg|right|frame|Descum results]]
| |
|
| |
| {| {{table}}
| |
| | align="center" |
| |
| {| border="1" cellspacing="1" cellpadding="2" align="center"
| |
|
| |
| |- style="background:LightGrey"
| |
| |'''Ashing time (min)'''|| 1|| 2 || 3 || 4 || 6 || 7 || 8 || 9 || 10 || 12 || 14 || 15 || 20
| |
| |-
| |
| |'''Etched Thickness (nm)'''|| 8,7 || 5,1 || 12,5 || 6,2 || 31,8 || 86,0 || 25,7 || 46,8 || 38,3 || 49,7 || 59,4 || 140,1 || 360,7
| |
| |-
| |
| |}
| |
Revision as of 15:13, 19 November 2019
Feedback to this page: click here
Descum results
Plasma asher 1
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer.
Note: Plasma asher was cold before use
Settings
|
Etched Thickness (nm)
|
|
ashing time (min)
|
Recipe |
O2 flow |
N2 flow |
Power
|
1 |
2 |
5 |
7 |
10 |
10
|
1 |
70 |
70 |
150 |
14,2 |
16,3 |
47,6 |
123,2 |
854,3 |
862,1
|
2 |
500 |
0 |
200 |
|
8,1 |
32,9 |
271,1 |
495,6 |
446,2
|
Conny Hjort & Jesper Hanberg
September 2019
|