Specific Process Knowledge/Lithography/Descum: Difference between revisions

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Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer.

Note: Plasma asher was cold before use

Conny Hjort & Jesper Hanberg September 2019

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Revision as of 14:33, 19 November 2019 view source Jiurban (talk \| contribs) NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 54 edits →‎Plasma asher 2 ← Older edit		Revision as of 14:33, 19 November 2019 view source Jiurban (talk \| contribs) NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 54 edits →‎Plasma asher 2 Newer edit →
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	[[Image:descum_graf.jpg\|right\|400px\|frame\|Descum results]]		[[Image:descum_graf.jpg\|right\|400px\|frame\|Descum results]]

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