Specific Process Knowledge/Lithography/Descum: Difference between revisions
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===Plasma asher 2 === | ===Plasma asher 2 === | ||
[[File:graf_descum.png|400px|right|frame| Descum results]] | [[File:graf_descum.png|400px|right|frame| Descum results]] | ||
Revision as of 14:06, 19 November 2019
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Descum results
Plasma asher 1
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer.
Note: Plasma asher was cold before use
Plasma asher 2 |
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