Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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==Particulates on the films== | ==Particulates on the films== | ||
1. ''Testing November/December 2018 by Rebecca Ettlinger and Evgeniy Shkondin'' | ===1. ''Testing November/December 2018 by Rebecca Ettlinger and Evgeniy Shkondin''=== | ||
The number of particles that end up on the film depends on the material being deposited and the deposition parameters as well as the cleanliness of the wafer and the chamber. We have done some tests to compare particulates on the films in the Temescal and the Wordentec for different materials and process conditions. | The number of particles that end up on the film depends on the material being deposited and the deposition parameters as well as the cleanliness of the wafer and the chamber. We have done some tests to compare particulates on the films in the Temescal and the Wordentec for different materials and process conditions. | ||
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2. ''Testing July/August 2019 by Evgeniy Shkondin and Patama Pholprasit'' | ===2. ''Testing July/August 2019 by Evgeniy Shkondin and Patama Pholprasit''=== | ||
Deposition of Ti/Au revealed a big number of particles on the wafers. They amount has been heavily reduced by optimizing deposition conditions and choosing the right crucible. | Deposition of Ti/Au revealed a big number of particles on the wafers. They amount has been heavily reduced by optimizing deposition conditions and choosing the right crucible. | ||