Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

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 The full results of the testing can be found here: [[:File:particles-pinholes test Temescal.pptx]].
+''Testing July/August 2019 by Evgeniy Shkondin and Patama Pholprasit''
+Deposition of Ti/Au revealed a big number of particles on the wafers. They amount has been heavily reduced by optimizing deposition conditions and choosing the right crucible.
+The particles are in fact gold droplets of various size ejected from the melt.
+Main guidance and conclusions:
+*Ensure the chamber, shutters etc. are properly cleaned.
+*Use as pure Au target as possible.
+*Do not use ceramic crucible, put Au pellets directly into the dedicated Cu heart pocket. W-crucible can be considered (but so far we did not tested it).
+*Sweep puttern needs to be optimized so it coveres the bigger area of the target but avoid getting the beam to close to the edges.
+*Optimize soak/rise powers and times.
+*Use deposition rate of 2Å/s. Ensure that the rise2 power is adequate for that rate.
+*Ensure the appropriate PID values, since the deposition rate has to be stable during the evaporation.
+The full results of the testing can be found here: [[:File:Au issues with Temescal.pptx]].
 == Process information ==