Specific Process Knowledge/Lithography/Strip: Difference between revisions
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Time: 5 -30 min., depending on photoresist type and thickness | Time: 5 -30 min., depending on photoresist type and thickness | ||
A typical process time for stripping of 1.5 um AZ5214e resist is 25 min for 6 wafers load in a boat, recipe | A typical process time for stripping of 1.5 um AZ5214e resist is 25 min for 6 wafers load in a boat, recipe 18. | ||
A Descum process in | A Descum process in manual mode: O2:70, N2:70, power:150W, time:10min | ||
Be sure to wait for cooling if the mashine has been used at 1000W right before. | |||
At a load at 2 Fused silicawafers resist removed 0.01-01,5um | At a load at 2 Fused silicawafers resist removed 0.01-01,5um | ||