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| =Spin coaters at Danchip= | | =Spin coaters at Danchip= |
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| ==Spin Track 1 + 2==
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| [[image:SpinTrack.jpg|400px|right|thumb|Spin Track 1 + 2 in C-1]]
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| '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]'''
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| ===<span style="color:red">This spin coater was decommissionned 2018-02-01!</span>===
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| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''
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| Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
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| The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
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| '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
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| ===Process information===
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| *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
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| *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
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| *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]]
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| *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]]
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| *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#Post-exposure baking (PEB)|Post-exposure baking on Spin Track 2]]
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
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| |style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
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| |style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black"|
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| *HMDS priming
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| *Spin coating and soft baking
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| *Priming, coating, and baking
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| |style="background:WhiteSmoke; color:black"|
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| *HMDS priming
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| *Spin coating and soft baking
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| *Priming, coating, and baking
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| *Post-exposure baking
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Resist
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| AZ MiR 701 (29cps)
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| positive tone
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| |style="background:WhiteSmoke; color:black" align="center"|
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| AZ nLOF 2020
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| negative tone
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 1 - 3 µm
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 1 - 4 µm
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| |-
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| |style="background:LightGrey; color:black"|HMDS contact angle
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 60° - 90°; standard recipe 82° (on SiO2)
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 10 - 9990 rpm
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| |-
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1000 - 50000 rpm/s
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| |-
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| |style="background:LightGrey; color:black"|Hotplate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 90°C
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 110°C
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| |-
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| |style="background:LightGrey; color:black"|HMDS priming temperature
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 50°C
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 mm wafers
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| Silicon and glass wafers
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| Film or pattern of all types
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| |-
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1 - 25
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| |-
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| |}
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| <br clear="all" />
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| ==Spin Coater: Gamma UV== | | ==Spin Coater: Gamma UV== |
