Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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==Deposition of Silicon Oxide using sputter deposition technique== | ==Deposition of Silicon Oxide using sputter deposition technique== | ||
At DTU Nanolab you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]] | At DTU Nanolab you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]] | ||
sputter systems. One of the advantages here is that you can deposit on | sputter systems. One of the advantages here is that you can deposit on many kind of material. | ||
*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]] | *[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]] | ||