Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
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Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness. | Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness. | ||
''' | '''Do not use the power more than 180W''', since the Si target could break into a lot of small pieces. | ||
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