Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
| Line 26: | Line 26: | ||
|- | |- | ||
| Sputter pressure | | Sputter pressure | ||
| 5*10<sup>-3</sup> | | 5*10<sup>-3</sup> mbar | ||
| 1*10<sup>-2</sup> | | 1*10<sup>-2</sup> mbar | ||
|- | |- | ||
Revision as of 08:40, 15 August 2019
Silicon sputter
Silicon can be sputter deposited in Wordentec.
Parameters
Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.
Please don´t use higher power than 180W, since the target then could break into a lot of small pieces.
| Settings 1 | Settings 2 | |
|---|---|---|
| Process type | Sputtering | Sputtering |
| Power | 130W | 170W |
| Sputter pressure | 5*10-3 mbar | 1*10-2 mbar |
| Rate | About 0,7 Å/s | About 0,6 Å/s |