Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
| Line 26: | Line 26: | ||
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| Sputter pressure | | Sputter pressure | ||
| 5*10<sup>-3</sup> | | 5*10<sup>-3</sup> mbar | ||
| 1*10<sup>-2</sup> | | 1*10<sup>-2</sup> mbar | ||
|- | |- | ||