Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

Revision as of 09:38, 15 August 2019 view source Paphol (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 912 edits →Silicon sputter ← Older edit		Revision as of 09:38, 15 August 2019 view source Paphol (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 912 edits →Silicon sputter Newer edit →
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	Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.		Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.



	'''Please don´t use higher power than 180W''', since the target then could break into a lot of small pieces.		'''Please don´t use higher power than 180W''', since the target then could break into a lot of small pieces.