Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

Revision as of 08:38, 15 August 2019

Silicon sputter

Silicon can be sputter deposited in Wordentec.

Parameters

Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.

Please don´t use higher power than 180W, since the target then could break into a lot of small pieces.

	Settings 1	Settings 2
Process type	Sputtering	Sputtering
Power	130W	170W
Sputter pressure	5*10^-3	1*10^-2
Rate	About 0,7 Å/s	About 0,6 Å/s

@@ Line 6: / Line 6: @@
 '''Parameters'''
-Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.
+Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.
-Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.
+'''Please don´t use higher power than 180W''', since the target then could break into a lot of small pieces.
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