Specific Process Knowledge/Thermal Process/C2 Furnace III-V oxidation: Difference between revisions
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==III-V | ==III-V Oxidation furnace (C2)== | ||
The III-V | The III-V Oxidaiont furnace (C2) is being use on August 2019 for wet thermal oxidation of III-V devices instead of the III-V ovn, for instance for lateral oxidation of thin AlGaAs layers to defined apertures in light-limiting diodes. | ||
The furnace is an old Tempress horizontal furnace. The quartz boat is loaded manually into the furnace by use of a push rod. The furnace is cooled down to room temperature when it is not being used. | The furnace is an old Tempress horizontal furnace. The quartz boat is loaded manually into the furnace by use of a push rod. The furnace is cooled down to room temperature when it is not being used. |
Revision as of 13:40, 14 August 2019
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III-V Oxidation furnace (C2)
The III-V Oxidaiont furnace (C2) is being use on August 2019 for wet thermal oxidation of III-V devices instead of the III-V ovn, for instance for lateral oxidation of thin AlGaAs layers to defined apertures in light-limiting diodes.
The furnace is an old Tempress horizontal furnace. The quartz boat is loaded manually into the furnace by use of a push rod. The furnace is cooled down to room temperature when it is not being used.
Before use, devices have to be cleaned. A short BHF dip can be used to remove any native oxide which can be difficult to penetrate by a wet thermal oxidation.
Please check the cross contamination information in LabManager before you use the furnace.
The user manual and contact information can be found in LabManager:
Process knowledge
Purpose |
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Performance | Lateral oxidation rate |
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Process parameter range | Process temperature |
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Process pressure |
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Gasses on the system |
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Substrates | Batch size |
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Substrate materials allowed |
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