Specific Process Knowledge/Lithography/4562: Difference between revisions
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==Exposure== | ==Exposure== | ||
In order to avoid heating during exposure, leading to the formation of bubbles, it is recommended to use multiple exposure, limiting the exposure time for each cycle to 10-15s, and using a 10-15s pause between cycles. | |||
==Development== | ==Development== | ||
The recommended development speed for AZ 4562 is 2µm/min. A 6.2µm resist film thus requires 3min development, usually as three 60s puddles of TMAH (AZ 726 MIF). 10µm AZ 4562 has successfully been developed using 4x60s development | The recommended development speed for AZ 4562 is 2µm/min. A 6.2µm resist film thus requires 3min development, usually as three 60s puddles of TMAH (AZ 726 MIF). 10µm AZ 4562 has successfully been developed using 4x60s development | ||