Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nanobosch6: Difference between revisions

From LabAdviser
Jmli (talk | contribs)
Jmli (talk | contribs)
No edit summary
Line 1: Line 1:
<!--Checked for updates on 10/7-2019 - ok/jmli -->
<!-- Ok, jmli 20170627 -->
<!-- Ok, jmli 20170627 -->
<!-- Ok, jmli 20170627 -->
<!-- Ok, jmli 20170627 -->

Revision as of 09:49, 10 July 2019

Test run using AZ resist 24/9-2012

Process conditions
Substrate information Wafer C01296.05
Mask Travka50 mask in a few microns of AZ resist
Date 24/9-2012
Tool Pegasus
Process Recipe nanobosch6
Tool conditioning 3 minute TDESC clean
Process duration 15 minutes
Purpose test
Characterisation SEM Zeiss


Test run using AZ resist 24/9-2012

Process conditions
Substrate information Wafer C01296.09
Mask Travka80 mask in a few microns of AZ resist
Date 24/9-2012
Tool Pegasus
Process Recipe nanobosch6
Tool conditioning 3 minute TDESC clean
Process duration 15 minutes
Purpose test
Characterisation SEM Zeiss