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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
Line 200: Line 200:
| -6 (Feb 2019) <br> -2 (Apr 2019)
| -6 (Feb 2019) <br> -2 (Apr 2019)
| <750 nm
| <750 nm
| PEB: 60s@110°C, Dev: SP60s <br> Probably over-exposed
| PEB: 60s@110°C, Dev: SP60s <br> Large structures probably over-exposed
|-
|-


Line 218: Line 218:
| 0
| 0
| 1 µm
| 1 µm
| Dev: SP60s <br> Large structures probably under-exposed
| Dev: SP60s <br> Probably under-exposed
|-
|-


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