Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
No edit summary |
No edit summary |
||
| Line 38: | Line 38: | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 5Å/s | |1Å/s to 5Å/s | ||
| | |1Å/s to 15Å/s | ||
| | | | ||
|- | |- | ||
Revision as of 14:46, 16 December 2008
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter (Lesker) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1500 Å | 10Å to 1 µm | 10Å to |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 1Å/s to 15Å/s |
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings