Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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== Studies of Au deposition processes == | |||
[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited with different equipment and settings'' |
Revision as of 14:45, 16 December 2008
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter (Lesker) | |
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Batch size |
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Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
Layer thickness | 10Å to 1µm | 10Å to 1500 Å | 10Å to 1 µm | 10Å to |
Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s |
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings