Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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== Studies of Cu deposition processes == | |||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with Alcatel'' | |||
Revision as of 11:24, 16 December 2008
Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment |
| Layer thickness | 10Å to 0.5µm | 10Å to 1500Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s |
Studies of Cu deposition processes
Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel