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Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
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|19/3 2015
|19/3 2015
|taran
|taran
|SAT results. 4" wafer, no HMDS. 5 wafers measured: thickness is average of all 5; uniformity is worst case. 9 points on each wafer, exclusion zone 5mm.
|SAT results. 4" wafer. 5 wafers measured: thickness is average of all 5; uniformity is worst case. 9 points on each wafer, exclusion zone 5mm.
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|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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|19/3 2015
|19/3 2015
|taran
|taran
|SAT results. 6" wafer, no HMDS. 3 wafers measured: thickness is average of all 3; uniformity is worst case. 13 points on each wafer, exclusion zone 5mm.
|SAT results. 6" wafer. 3 wafers measured: thickness is average of all 3; uniformity is worst case. 13 points on each wafer, exclusion zone 5mm.
|}
|}


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|20/3 2015
|20/3 2015
|taran
|taran
|4" wafer, no HMDS. 9 points on one wafer, exclusion zone 5mm.
|4" wafer. 9 points on one wafer, exclusion zone 5mm.
|}
|}


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