Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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*There are fewer particles from just loading/pumping/venting/unloading wafers with no processing in the Wordentec than the Temescal, at least when tested in Nov/Dec 2018. | *There are fewer particles from just loading/pumping/venting/unloading wafers with no processing in the Wordentec than the Temescal, at least when tested in Nov/Dec 2018. | ||
The full results of the testing can be found here: | The full results of the testing can be found here: . | ||
== Process information == | == Process information == | ||