Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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== Process information == | == Process information == | ||
*[[/Acceptance Test|Acceptance Test]] | *[[/Acceptance Test|Acceptance Test]]. Describes thickness uniformity tests, side wall deposition tests, sheet resistance tests and tests of the ion source for substrate cleaning. | ||
====Materials for e-beam evaporation==== | ====Materials for e-beam evaporation==== | ||
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]] - thinner layers | *[[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]] - thinner layers | ||
Note that to date ( | Note that to date (Dec 2018) we have processes available for deposition of Al, Cr, Au, Ge, Nb, Ni, Pd, Pt, Ag, Ti, and W as well as Ru. More will be available as they are requested. | ||
==Equipment performance and process related parameters for the Temescal E-beam evaporator== | ==Equipment performance and process related parameters for the Temescal E-beam evaporator== | ||