Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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Below you can read about using an organosilane adhesion layer. | Below you can read about using an organosilane adhesion layer. | ||
== Thin Au layer deposition using Lesker== | == Thin Au layer deposition using APTMS adhesion layer and sputter system Lesker == | ||
For depositing very thin, down to 6nm continuous Au layers on Si/SiO<sub>2</sub> substrates. Works also with ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> as substrate. | For depositing very thin, down to 6nm continuous Au layers on Si/SiO<sub>2</sub> substrates. Works also with ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> as substrate. | ||