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Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''
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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe adhesion layers for gold deposition and the roughness of gold deposited in the Wordentec.


== Au deposition ==
== Au deposition ==
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