Specific Process Knowledge/Wafer cleaning: Difference between revisions

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 == Clean with: ==
-*[[Cleaning with RCA|RCA]] - ''Two step process to remove organics and metals''
+*[[/RCA|RCA]] - ''Two step process to remove organics and metals''
-*[[Cleaning with 7-up|7-up]] - ''Fake piranha etch of wafers and masks - removes organics and alkali ions''
+*[[/7-up|7-up]] - ''Fake piranha etch of wafers and masks - removes organics and alkali ions''
-*[[Cleaning with Piranha|Piranha]] - ''Removes organics and alkali ions''
+*[[/Piranha|Piranha]] - ''Removes organics and alkali ions''
-*[[Cleaning with BHF|BHF]] - ''Removing native oxide, etching of predep glass etc.''
+*[[/cleaning with BHF|BHF]] - ''Removing native oxide, etching of predep glass etc.''
-*[[Cleaning with IMEC|IMEC]] - ''Cleaning before fusion bonding''
+*[[/IMEC|IMEC]] - ''Cleaning before fusion bonding''
-*[[Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
+*[[/Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''