Specific Process Knowledge/Etch: Difference between revisions
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== Choose a wet etch == | == Choose a wet etch == | ||
*[[Wet Silicon Nitride Etch]] | *[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]] | ||
*[[Wet Silicon Oxide Etch (BHF)]] | *[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]] | ||
*[[KOH Etch]] - ''Anisotropic silicon etch'' | *[[/KOH Etch|KOH Etch]] - ''Anisotropic silicon etch'' | ||
*[[Wet Polysilicon Etch]] - ''Isotropic silicon etch'' | *[[/Wet Polysilicon Etch|Wet Polysilicon Etch]] - ''Isotropic silicon etch'' | ||
*[[Wet Aluminium Etch]] | *[[/Wet Aluminium Etch|Wet Polysilicon Etch]] | ||
Revision as of 12:11, 17 October 2007
Choose material to be etched
- Aluminium
- Chromium
- Titanium
- Gold
- Platin
- Polymer
- Silicon
- Silicon Nitride
- Silicon Oxide
- Bulk Glass - Borofloat (pyrex) and fused silica (quartz)
Choose a dry etch equipment
Choose a wet etch
- Wet Silicon Nitride Etch
- Wet Silicon Oxide Etch (BHF)
- KOH Etch - Anisotropic silicon etch
- Wet Polysilicon Etch - Isotropic silicon etch
- Wet Polysilicon Etch