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Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions

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Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
284 edits
Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
284 edits
Line 77: Line 77:
|style="background:LightGrey; color:black"|Arm sweep
|style="background:LightGrey; color:black"|Arm sweep
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Thinning: stationary
*Polishing: 20% (inner) - 100% (outer)
*Polishing: 12% (inner) - 80% (outer)
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|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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