Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Sample size | ||
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*<nowiki>#</nowiki> | *<nowiki>#</nowiki> one 20x20mm piece | ||
*one 50 mm wafer | *one 50 mm wafer | ||
*one 2" wafer | |||
*one 100 mm wafer | *one 100 mm wafer | ||
*one 150mm wafer | |||
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*<nowiki>#</nowiki> small samples | *<nowiki>#</nowiki> small samples | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon | *Silicon | ||
*Glass/Quartz | *Glass/Quartz | ||
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