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Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
285 edits
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[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]


The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.  
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.  
 


'''The user manual, user APV, technical information and contact information can be found in LabManager:'''  
'''The user manual, user APV, technical information and contact information can be found in LabManager:'''  
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