Specific Process Knowledge/Wafer cleaning: Difference between revisions
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![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] | ![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] | ||
![[Specific Process Knowledge/Wafer cleaning/Cleaning with Soap Sonic|Soap Sonic]] | ![[Specific Process Knowledge/Wafer cleaning/Cleaning with Soap Sonic|Soap Sonic]] | ||
![[Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner|Post CMP Cleaner]] | |||
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Make the surface hydrophillic | Make the surface hydrophillic | ||
|Removing dust and particles | |Removing dust and particles | ||
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|Recommended cleaning and treatment before wafer bonding | |Recommended cleaning and treatment before wafer bonding | ||
|Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | |Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | ||
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*<nowiki>#</nowiki>1-25 2" and 4" wafers | *<nowiki>#</nowiki>1-25 2" and 4" wafers | ||
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*All sizes that can go into the bath | *All sizes that can go into the bath| | ||
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*All materials | *All materials | ||
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