Specific Process Knowledge/Characterization: Difference between revisions

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==Overview of characteristics and where to measure it==
==Overview of characteristics and where to measure it==
{| {{table}}
{| {{table } }
|  width="50" align="center" style="background:#f0f0f0;"|  
|  width="50" align="center" style="background:#f0f0f0;"|  
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]'''
Line 25: Line 25:
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]'''
|  width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]'''
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Breakdown voltage||||||||||||||||||||||||||||||||||||||||
| Breakdown voltage
||||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Carrier density/doping profile||||||||||||||||||||||||||||||||||||||||x
| Carrier density/doping profile  
||||||||||||||||||||||||||||||||||||||||x


|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Crystallinity||||||||||||||||||||||||||x||||||||x||||||
| Crystallinity||||||||||||||||||||||||||x||||||||x||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Dimensions(in plane)||x||x||(x)||(x)||x||||||||||||||||||||||||||||||
| Dimensions(in plane)||x||x||(x)||(x)||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x||||||||||||||
| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||
|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Optical gap||||||||||||||x||||||x||||||||||||||||||||
| Optical gap||||||||||||||x||||||x||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Particles||x||x||x||||||||||||||||||||||||||||||x||||
| Particles||x||x||x||||||||||||||||||||||||||||||x||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Phase changes||||||||||||||||||||||||||||||||||x||||||
| Phase changes||||||||||||||||||||||||||||||||||x||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||
| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Resistivity||||||||||||||||||||||x||||||||||||||||||
| Resistivity||||||||||||||||||||||x||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| Surface roughness||||||x||x||x||||||||||||||||||||||||||||||
| Surface roughness||||||x||x||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#C0C0C0;" align="center"
| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||||x||
| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||||x||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#DCDCDC;" align="center"
| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||


Revision as of 13:55, 12 November 2018

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Overview of characteristics and where to measure it

Optical Micro- scopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflec- tometer) Ellip- someter Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester Differential Scanning Calorimeter DSC Surfscan IR-camera III-V ECV-profiler
Breakdown voltage
Carrier density/doping profile x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Crystallinity x x
Deposition uniformity x x x
Dimensions(in plane) x x (x) (x) x
Dimensions(height) (x) (x) x x x
Electrical conductivity x
Element analysis x x x 4) x 4)
Film stress x x
Imaging x x x x
Material Hardness x
Optical gap x x
Particles x x x x
Phase changes x
Reflectivity x x x 6)
Refractive index x x
Resistivity x
Step coverage x 1) x 1)
Surface roughness x x x
Thermal conductivity
Thin film thickness x 1) x 1) x 2) x 2) x x x x 5) x 3) x
Voids in wafer bonding x x x
Wafer thickness x 1) x 1) x
  1. Using the cross section method
  2. Using the create step method
  3. With known resistivity
  4. Composition information for crystalline materials
  5. Only single layer
  6. Good for characterization of VCSEL structures and DBR mirrors

Choose characterization topic

Choose equipment

AFM

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization

SEMs at CEN

SEMs at Danchip

TEMs at CEN

Electrical measurements

Various

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