Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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'''***''' ''For thicknesses above 120 nm please get permission from ThinFilm group by writing to thinfilm@danchip.dtu.dk'' | '''***''' ''For thicknesses above 120 nm please get permission from ThinFilm group by writing to thinfilm@danchip.dtu.dk'' | ||
==Aluminium deposition on ZEP520A for lift-off== | ==Aluminium deposition on ZEP520A for lift-off - comparison of thermal and e-beam evaporation == | ||
This is a small study of which aluminium deposition that is best for aluminium lift-off on ZEP520A resist and a very thin layer of aluminium (~20nm). | This is a small study of which aluminium deposition that is best for aluminium lift-off on ZEP520A resist and a very thin layer of aluminium (~20nm). The grain size is compared for the different methods. | ||
The conclusion was that e-beam evaporation of aluminium in the Alcatel at 15Å/s gave the best result. | The conclusion was that e-beam evaporation of aluminium in the Alcatel at 15Å/s gave the best result. | ||
See details of the study [[/Aluminium deposition on ZEP520A for lift-off|here]]. | See details of the study [[/Aluminium deposition on ZEP520A for lift-off|here]]. | ||
==Aluminium deposition on AZ5214 for lift-off== | ==Aluminium deposition on AZ5214 for lift-off== | ||